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BDBM162141

E3L007263
Internal ID: BDB007263
Activity data available Local docking-ready structure
Dock with Q00987
Structure
/e3_file/ligand_db/generated/BDB007263/BDB007263.sdf
Basic Properties
Compound ID
E3L007263
Internal ID
BDB007263
Molecular formula
C36H44ClN5O4
Molecular weight
646.232000
Exact mass
645.308183
XLogP
5.9360
TPSA
78.4500
HBA / HBD
7 / 0
Rotatable bonds
9
Heavy atoms / rings
46 / 6
Activity summary
IC50 unknown 5.70000000 nM
1 activity record(s) imported
InChIKey
DPPMYLOYLBNZNP-BXKNEMSHSA-N
SMILES
COc1cc2c(cc1OC(C)C)[C@H](c1ccc(Cl)cc1)N(c1ccc(N(C)C[C@H]3CC[C@H](N4CC(=O)N(C)C4)CC3)cn1)C(=O)C2
Aliases
BDBM162141 (preferred) BDBM162141 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
Q00987 MDM2
E3 ubiquitin-protein ligase Mdm2		 reported_binder bindingdb_reported Yes No low BindingDB:BDBM162141 medium
; target=E3 ubiquitin-protein ligase Mdm2
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM162141 Open - 10.7270/Q2DV1HMM
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready COc1cc2c(cc1OC(C)C)[C@H](c1ccc(Cl)cc1)N(c1ccc(N(C)C[C@H]3CC[C@H](N4CC(=O)N(C)C4)CC3)cn1)C(=O)C2 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB007263/BDB007263.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB007263/BDB007263.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB007263/BDB007263.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB007263/BDB007263.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB007263/BDB007263.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
E3 ubiquitin-protein ligase Mdm2
Q00987
E3 ligase component 		BindingDB:BDBM162141 IC50 5.7 nM Very high DOI: 10.7270/Q2DV1HMM 1