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BDBM224741

E3L010826
Internal ID: BDB010826
Activity data available Local docking-ready structure
Dock with Q00987
Structure
/e3_file/ligand_db/generated/BDB010826/BDB010826.sdf
Basic Properties
Compound ID
E3L010826
Internal ID
BDB010826
Molecular formula
C30H36FN7O2
Molecular weight
545.663000
Exact mass
545.291452
XLogP
5.8154
TPSA
114.5200
HBA / HBD
7 / 2
Rotatable bonds
8
Heavy atoms / rings
40 / 7
Activity summary
IC50 unknown 10.00000000 nM
1 activity record(s) imported
InChIKey
WCVSZPLGKILJFB-GUDVDZBRSA-N
SMILES
C[C@@H](Nc1nc(-c2noc(=O)[nH]2)nc2nc(C3(c4ccc(F)cc4)CC3)n(C[C@H]3CC[C@H](C)CC3)c12)C1CCC1
Aliases
BDBM224741 (preferred) BDBM224741 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
Q00987 MDM2
E3 ubiquitin-protein ligase Mdm2
reported_binder bindingdb_reported Yes No low BindingDB:BDBM224741 medium
; target=E3 ubiquitin-protein ligase Mdm2
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM224741 Open - 10.7270/Q2RF5X1F
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready C[C@@H](Nc1nc(-c2noc(=O)[nH]2)nc2nc(C3(c4ccc(F)cc4)CC3)n(C[C@H]3CC[C@H](C)CC3)c12)C1CCC1 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB010826/BDB010826.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB010826/BDB010826.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB010826/BDB010826.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB010826/BDB010826.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB010826/BDB010826.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
E3 ubiquitin-protein ligase Mdm2
Q00987
E3 ligase component
BindingDB:BDBM224741 IC50 10 nM Very high DOI: 10.7270/Q2RF5X1F 1