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US10807959, Example 20

E3L019591
Internal ID: BDB019591
Activity data available Local docking-ready structure
Dock with P61964
Structure
/e3_file/ligand_db/generated/BDB019591/BDB019591.sdf
Basic Properties
Compound ID
E3L019591
Internal ID
BDB019591
Molecular formula
C27H31N5O3
Molecular weight
473.577000
Exact mass
473.242690
XLogP
3.6140
TPSA
96.8700
HBA / HBD
7 / 3
Rotatable bonds
8
Heavy atoms / rings
35 / 4
Activity summary
Ki unknown 0.60000000 nM
1 activity record(s) imported
InChIKey
MSCXJTMDQLDZMM-UHFFFAOYSA-N
SMILES
COc1cc(OC)cc(C(C)NC(=O)c2cc(CNC3=NCCN3)cc(-c3cnccc3C)c2)c1
Aliases
BDBM468751 (preferred) US10807959, Example 20 (source_name) BDBM468751 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P61964 WDR5;BIG3
WD repeat-containing protein 5
reported_binder bindingdb_reported Yes No low BindingDB:BDBM468751 medium
; target=WD repeat-containing protein 5
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM468751 Open - 10.7270/Q26Q219X
PubChem CID146370994 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready COc1cc(OC)cc(C(C)NC(=O)c2cc(CNC3=NCCN3)cc(-c3cnccc3C)c2)c1 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB019591/BDB019591.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB019591/BDB019591.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB019591/BDB019591.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB019591/BDB019591.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB019591/BDB019591.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
WD repeat-containing protein 5
P61964
E3 ligase component
BindingDB:BDBM468751 Ki 0.6 nM Very high DOI: 10.7270/Q26Q219X 1