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US10807959, Example 54

E3L019624
Internal ID: BDB019624
Activity data available Local docking-ready structure
Dock with P61964
Structure
/e3_file/ligand_db/generated/BDB019624/BDB019624.sdf
Basic Properties
Compound ID
E3L019624
Internal ID
BDB019624
Molecular formula
C26H27ClFN5O
Molecular weight
479.987000
Exact mass
479.188816
XLogP
5.3258
TPSA
79.2700
HBA / HBD
5 / 2
Rotatable bonds
6
Heavy atoms / rings
34 / 4
Activity summary
Ki unknown 0.31000000 nM
1 activity record(s) imported
InChIKey
PYLZSMLKKINSES-UHFFFAOYSA-N
SMILES
Cc1cc(C(C)NC(=O)c2cc(CNC3=NCCC3)cc(-c3ccc(F)nc3C)c2)ncc1Cl
Aliases
BDBM468784 (preferred) US10807959, Example 54 (source_name) BDBM468784 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P61964 WDR5;BIG3
WD repeat-containing protein 5
reported_binder bindingdb_reported Yes No low BindingDB:BDBM468784 medium
; target=WD repeat-containing protein 5
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM468784 Open - 10.7270/Q26Q219X
PubChem CID146370800 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready Cc1cc(C(C)NC(=O)c2cc(CNC3=NCCC3)cc(-c3ccc(F)nc3C)c2)ncc1Cl keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB019624/BDB019624.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB019624/BDB019624.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB019624/BDB019624.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB019624/BDB019624.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB019624/BDB019624.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
WD repeat-containing protein 5
P61964
E3 ligase component
BindingDB:BDBM468784 Ki 0.31 nM Very high DOI: 10.7270/Q26Q219X 1