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(S,S)-Cpi-1612

E3L024160
Internal ID: BDB024160
Activity data available Local docking-ready structure
Dock with Q09472
Structure
/e3_file/ligand_db/generated/BDB024160/BDB024160.sdf
Basic Properties
Compound ID
E3L024160
Internal ID
BDB024160
Molecular formula
C27H26N6O
Molecular weight
450.546000
Exact mass
450.216809
XLogP
4.4269
TPSA
95.6300
HBA / HBD
5 / 2
Rotatable bonds
8
Heavy atoms / rings
34 / 4
Activity summary
IC50 unknown 8.30000000 nM
1 activity record(s) imported
InChIKey
SEDFZSHSBUXKAC-BCHFMIIMSA-N
SMILES
C[C@H](CN[C@H](C(=O)Nc1ccc(-c2cnn(C)c2)cn1)c1ccccc1)c1ccc(C#N)cc1
Aliases
BDBM542145 (preferred) (S,S)-Cpi-1612 (source_name) BDBM542145 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
Q09472 EP300;P300
Histone acetyltransferase p300		 reported_binder bindingdb_reported Yes No low BindingDB:BDBM542145 medium
; target=Histone acetyltransferase p300
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM542145 Open - 10.7270/Q2C53Q11
PubChem CID139426012 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready C[C@H](CN[C@H](C(=O)Nc1ccc(-c2cnn(C)c2)cn1)c1ccccc1)c1ccc(C#N)cc1 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB024160/BDB024160.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB024160/BDB024160.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB024160/BDB024160.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB024160/BDB024160.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB024160/BDB024160.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Histone acetyltransferase p300
Q09472
E3 ligase component 		BindingDB:BDBM542145 IC50 8.3 nM Very high DOI: 10.7270/Q2C53Q11 1