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BDBM553364

E3L026025
Internal ID: BDB026025
Activity data available Local docking-ready structure
Dock with P61964
Structure
/e3_file/ligand_db/generated/BDB026025/BDB026025.sdf
Basic Properties
Compound ID
E3L026025
Internal ID
BDB026025
Molecular formula
C29H31F4N7O2
Molecular weight
585.606000
Exact mass
585.247536
XLogP
4.3159
TPSA
97.4600
HBA / HBD
7 / 2
Rotatable bonds
5
Heavy atoms / rings
42 / 5
Activity summary
Kd unknown 2.45000000 nM
1 activity record(s) imported
InChIKey
FENWQPLSGDEGSV-HDICACEKSA-N
SMILES
Cc1cnc(N2CC=C(c3cc(NC(=O)c4c[nH]c(=O)cc4C(F)(F)F)c(N4C[C@@H](C)N(C)[C@@H](C)C4)cc3F)C2)nc1
Aliases
BDBM553364 (preferred) BDBM553364 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P61964 WDR5;BIG3
WD repeat-containing protein 5		 reported_binder bindingdb_reported Yes No low BindingDB:BDBM553364 medium
; target=WD repeat-containing protein 5
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM553364 Open - 10.7270/Q27W6GD6
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready Cc1cnc(N2CC=C(c3cc(NC(=O)c4c[nH]c(=O)cc4C(F)(F)F)c(N4C[C@@H](C)N(C)[C@@H](C)C4)cc3F)C2)nc1 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB026025/BDB026025.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB026025/BDB026025.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB026025/BDB026025.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB026025/BDB026025.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB026025/BDB026025.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
WD repeat-containing protein 5
P61964
E3 ligase component 		BindingDB:BDBM553364 Kd 2.45 nM Very high DOI: 10.7270/Q27W6GD6 1