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US20250082630, Example 6

E3L036177
Internal ID: BDB036177
Activity data available Local docking-ready structure
Dock with P09874
Structure
/e3_file/ligand_db/generated/BDB036177/BDB036177.sdf
Basic Properties
Compound ID
E3L036177
Internal ID
BDB036177
Molecular formula
C22H24FN5O2
Molecular weight
409.465000
Exact mass
409.191403
XLogP
2.1678
TPSA
91.8900
HBA / HBD
6 / 1
Rotatable bonds
4
Heavy atoms / rings
30 / 4
Activity summary
IC50 unknown 4.00000000 nM
1 activity record(s) imported
InChIKey
GTTUNDZFPRRXLZ-UHFFFAOYSA-N
SMILES
CC1=Nc2ccc(CN3CCN(c4ccc(C(N)=O)nc4C)CC3)c(F)c2CC1=O
Aliases
BDBM726501 (preferred) US20250082630, Example 6 (source_name) BDBM726501 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P09874 PARP1;ADPRT;PPOL
Poly [ADP-ribose] polymerase 1
reported_binder bindingdb_reported Yes No low BindingDB:BDBM726501 medium
; target=Poly [ADP-ribose] polymerase 1
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM726501 Open - 10.7270/Q27M0DG7
PubChem CID163655674 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready CC1=Nc2ccc(CN3CCN(c4ccc(C(N)=O)nc4C)CC3)c(F)c2CC1=O keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB036177/BDB036177.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB036177/BDB036177.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB036177/BDB036177.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB036177/BDB036177.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB036177/BDB036177.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Poly [ADP-ribose] polymerase 1
P09874
E3 ligase component
BindingDB:BDBM726501 IC50 4 nM Very high DOI: 10.7270/Q27M0DG7 1