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US12459899, Example 197

E3L042628
Internal ID: BDB042628
Activity data available Local docking-ready structure
Dock with P09874
Structure
/e3_file/ligand_db/generated/BDB042628/BDB042628.sdf
Basic Properties
Compound ID
E3L042628
Internal ID
BDB042628
Molecular formula
C26H27FN4O
Molecular weight
430.527000
Exact mass
430.216890
XLogP
4.1331
TPSA
63.1300
HBA / HBD
4 / 1
Rotatable bonds
5
Heavy atoms / rings
32 / 5
Activity summary
IC50 < 1.00000000 nM
1 activity record(s) imported
InChIKey
JVNZTPTWVBSTBM-UHFFFAOYSA-N
SMILES
Cc1ccc(F)c2c(=O)[nH]c(CCCN3C4CCC3CN(c3ccc(C#N)cc3)C4)cc12
Aliases
BDBM784104 (preferred) US12459899, Example 197 (source_name) BDBM784104 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P09874 PARP1;ADPRT;PPOL
Poly [ADP-ribose] polymerase 1
reported_binder bindingdb_reported Yes No low BindingDB:BDBM784104 medium
; target=Poly [ADP-ribose] polymerase 1
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM784104 Open - 10.7270/Q27W6J0N
PubChem CID156318842 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready Cc1ccc(F)c2c(=O)[nH]c(CCCN3C4CCC3CN(c3ccc(C#N)cc3)C4)cc12 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB042628/BDB042628.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB042628/BDB042628.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB042628/BDB042628.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB042628/BDB042628.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB042628/BDB042628.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Poly [ADP-ribose] polymerase 1
P09874
E3 ligase component
BindingDB:BDBM784104 IC50 <1 nM Very high DOI: 10.7270/Q27W6J0N 1