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US12459899, Example 204

E3L042634
Internal ID: BDB042634
Activity data available Local docking-ready structure
Dock with P09874
Structure
/e3_file/ligand_db/generated/BDB042634/BDB042634.sdf
Basic Properties
Compound ID
E3L042634
Internal ID
BDB042634
Molecular formula
C24H24FN5O
Molecular weight
417.488000
Exact mass
417.196489
XLogP
3.2197
TPSA
76.0200
HBA / HBD
5 / 1
Rotatable bonds
5
Heavy atoms / rings
31 / 5
Activity summary
IC50 unknown 0.65000000 nM
1 activity record(s) imported
InChIKey
QITQBVHGDLOYOO-UHFFFAOYSA-N
SMILES
N#Cc1ccc(N2CC3CCC(C2)N3CCCc2cc3ccc(F)cc3c(=O)[nH]2)nc1
Aliases
BDBM784111 (preferred) US12459899, Example 204 (source_name) BDBM784111 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P09874 PARP1;ADPRT;PPOL
Poly [ADP-ribose] polymerase 1
reported_binder bindingdb_reported Yes No low BindingDB:BDBM784111 medium
; target=Poly [ADP-ribose] polymerase 1
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM784111 Open - 10.7270/Q27W6J0N
PubChem CID156318023 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready N#Cc1ccc(N2CC3CCC(C2)N3CCCc2cc3ccc(F)cc3c(=O)[nH]2)nc1 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB042634/BDB042634.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB042634/BDB042634.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB042634/BDB042634.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB042634/BDB042634.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB042634/BDB042634.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Poly [ADP-ribose] polymerase 1
P09874
E3 ligase component
BindingDB:BDBM784111 IC50 0.65 nM Very high DOI: 10.7270/Q27W6J0N 1