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BDBM50022960

E3L044334
Internal ID: BDB044334
Activity data available Local docking-ready structure
Dock with P00797
Structure
/e3_file/ligand_db/generated/BDB044334/BDB044334.sdf
Basic Properties
Compound ID
E3L044334
Internal ID
BDB044334
Molecular formula
C38H60N6O7
Molecular weight
712.933000
Exact mass
712.452348
XLogP
4.3402
TPSA
183.7700
HBA / HBD
8 / 6
Rotatable bonds
19
Heavy atoms / rings
51 / 3
Activity summary
IC50 unknown 4.00000000 nM
1 activity record(s) imported
InChIKey
JKRQURRQRTUNRU-YRCZKMHPSA-N
SMILES
COc1ccc(C[C@H](NC(=O)OC(C)(C)C)C(=O)N[C@@H](Cc2c[nH]cn2)C(=O)N[C@@H](CC2CCCCC2)[C@@H](O)CCNC(=O)CCC(C)C)cc1
Aliases
BDBM50022960 (preferred) BDBM50022960 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P00797 REN
Renin		 reported_binder bindingdb_reported Yes No low BindingDB:BDBM50022960 medium
; target=Renin
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM50022960 Open - 10.1021/jm00390a018 PMID: 3298652
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready COc1ccc(C[C@H](NC(=O)OC(C)(C)C)C(=O)N[C@@H](Cc2c[nH]cn2)C(=O)N[C@@H](CC2CCCCC2)[C@@H](O)CCNC(=O)CCC(C)C)cc1 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB044334/BDB044334.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB044334/BDB044334.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB044334/BDB044334.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB044334/BDB044334.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB044334/BDB044334.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Renin
P00797
E3 ligase component 		BindingDB:BDBM50022960 IC50 4 nM Very high DOI: 10.1021/jm00390a018
PMID: 3298652 		1