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BDBM50028317

E3L044594
Internal ID: BDB044594
Activity data available Local docking-ready structure
Dock with P00797
Structure
/e3_file/ligand_db/generated/BDB044594/BDB044594.sdf
Basic Properties
Compound ID
E3L044594
Internal ID
BDB044594
Molecular formula
C18H35N3O4
Molecular weight
357.495000
Exact mass
357.262757
XLogP
0.9405
TPSA
121.5200
HBA / HBD
4 / 4
Rotatable bonds
11
Heavy atoms / rings
25 / 0
Activity summary
IC50 > 330000.00000000 nM
1 activity record(s) imported
InChIKey
RLCRPAALSXZAIG-BHVXPOTESA-N
SMILES
CC(C)CC(=O)N[C@@H](C(=O)N[C@@H](CC(C)C)C(O)CC(N)=O)C(C)C
Aliases
BDBM50028317 (preferred) 3-Hydroxy-6-methyl-4-[3-methyl-2-(3-methyl-butyrylamino)-butyrylamino]-heptanoic acid amide (source_name) BDBM50028317 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P00797 REN
Renin		 reported_binder bindingdb_reported Yes No low BindingDB:BDBM50028317 medium
; target=Renin
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM50028317 Open - 10.1021/jm00175a006 PMID: 6767029
PubChem CID44340320 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready CC(C)CC(=O)N[C@@H](C(=O)N[C@@H](CC(C)C)C(O)CC(N)=O)C(C)C keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB044594/BDB044594.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB044594/BDB044594.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB044594/BDB044594.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB044594/BDB044594.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB044594/BDB044594.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Renin
P00797
E3 ligase component 		BindingDB:BDBM50028317 IC50 >330000 nM Low DOI: 10.1021/jm00175a006
PMID: 6767029 		1