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BDBM50093360

E3L045569
Internal ID: BDB045569
Activity data available Local docking-ready structure
Dock with P09874
Structure
/e3_file/ligand_db/generated/BDB045569/BDB045569.sdf
Basic Properties
Compound ID
E3L045569
Internal ID
BDB045569
Molecular formula
C15H13N3O2
Molecular weight
267.288000
Exact mass
267.100777
XLogP
1.8211
TPSA
92.0000
HBA / HBD
3 / 3
Rotatable bonds
3
Heavy atoms / rings
20 / 3
Activity summary
Ki unknown 6.80000000 nM
1 activity record(s) imported
InChIKey
HZBRMMXOFOLUDV-UHFFFAOYSA-N
SMILES
NC(=O)c1cccc2[nH]c(-c3cccc(CO)c3)nc12
Aliases
BDBM50093360 (preferred) 2-(3-Hydroxymethyl-phenyl)-1H-benzoimidazole-4-carboxylic acid amide (source_name) BDBM50093360 (source_id)
E3 Relation
E3 UniProt Gene / protein Relation type Ligand role Direct Functional Docking Source Evidence
P09874 PARP1;ADPRT;PPOL
Poly [ADP-ribose] polymerase 1
reported_binder bindingdb_reported Yes No low BindingDB:BDBM50093360 medium
; target=Poly [ADP-ribose] polymerase 1
Sources and Literature
Source Source ID Source URL Download URL DOI / PMID
BindingDB BDBM50093360 Open - 10.1021/jm000950v PMID: 11063605
PubChem CID10587888 Open -
Structure Files
Kind Format Status Docking use File / link Preparation note
canonical_2d SMILES raw Docking-ready NC(=O)c1cccc2[nH]c(-c3cccc(CO)c3)nc12 keep_bindingdb_unique
generated_3d SDF prepared Docking-ready public/e3_file/ligand_db/generated/BDB045569/BDB045569.sdf Generated from canonical SMILES
generated_3d MOL2 prepared Docking-ready public/e3_file/ligand_db/generated/BDB045569/BDB045569.mol2 Generated from canonical SMILES
docking_ready PDBQT prepared Docking-ready public/e3_file/ligand_db/generated/BDB045569/BDB045569.pdbqt Generated from canonical SMILES
image PNG prepared Reference public/e3_file/ligand_db/generated/BDB045569/BDB045569.png Generated from canonical SMILES
image SVG prepared Reference public/e3_file/ligand_db/generated/BDB045569/BDB045569.svg Generated from canonical SMILES
Activity
Target Source Assay Result Potency Literature Records
Poly [ADP-ribose] polymerase 1
P09874
E3 ligase component
BindingDB:BDBM50093360 Ki 6.8 nM Very high DOI: 10.1021/jm000950v
PMID: 11063605
1